Techsource is a leader in cutting edge thermal adhesives for folded, bonded, and pin fin heatsinks. We specialize in thermally conductive, electrically insulating adhesives, dielectric coatings and encapsulants used in the manufacture of power supplies and heatsinks. We can also formulate products to meet your specific requirements, and offer prototypes and small production runs.
CLICK ON PART NUMBER TO OPEN SPECIFICATION SHEET IN NEW WINDOW| TCE-22343 | A low viscosity, dielectric coating, easily applied using conventional spray equipment. | ||
| TCE-22780 | A medium viscosity, aluminum filled bonding resin typically used to assemble bonded-, folded-, and pin-fins to a heatsink base. | ||
| TCE-22890 | A medium viscosity, aluminum oxide filled casting resin compound used for encapsulating and potting. Pigmented black for excellent thermal absorbtion and emission. | ||