BOARD LEVEL POWER SEMICONDUCTOR HEATSINK SELECTION SHEET

Techsource Thermal Solutions' line of compact, power dissipating, aluminum extruded heatsinks for Power Semiconductors have pressed-in solderable pins to allow vertical mounting without stress on the device leads. Most are pre-drilled to accommodate a single TO- package.

CLICK ON PART NUMBER FOR SPECIFICATION SHEET ("HEIGHT" IS ABOVE PC BOARD)

 

 

D: mm(in.)

W: mm(in.)

H: mm(in.)

PACKAGE

MAO- series

RPB10MAO

12.7 (.50)

34.9 (1.38)

25.4 (1.00)

TO-218

RPB15MAO

 

 

38.1 (1.50)

 

RPB20MAO

 

 

50.8 (2.00)

 

RPB25MAO

 

 

63.5 (2.50)

 

MAR- series

RPB10MAR

12.7 (.50)

34.9 (1.38)

25.4 (1.00)

TO-220

RPB15MAR

 

 

38.1 (1.50)

 

RPB20MAR

 

 

50.8 (2.00)

 

RPB25MAR

 

 

63.5 (2.50)

 

MES- series

RPB10MES

12.7 (.50)

34.9 (1.38)

25.4 (1.00)

TO-220

RPB15MES

 

 

38.1 (1.50)

 

RPB20MES

 

 

50.8 (2.00)

 

RPB25MES

 

 

63.5 (2.50)

 

MDH- series

RPB10MDH

16.26 (.64)

16.26 (.64)

25.4 (1.00)

TO-220

RPB15MDH

 

 

38.1 (1.50)

 

RPB20MDH

 

 

50.8 (2.00)

 

MLP- series

RPB10MLP

25.4 (1.00)

41.9 (1.65)

25.4 (1.00)

TO-220
TO-247
TO-218

RPB15MLP

 

 

38.1 (1.50)

RPB20MLP

 

 

50.8 (2.00)

RPB25MLP

 

 

63.5 (2.50)

MLS- series

RPB10MLS

25.4 (1.00)

41.9 (1.65)

25.4 (1.00)

TO-218

RPB15MLS

 

 

38.1 (1.50)

RPB20MLS

 

 

50.8 (2.00)

RPB25MLS

 

 

63.5 (2.50)

MGR- series

RPB10MGR

25.4 (1.00)

41.9 (1.65)

25.4 (1.00)

TO-220

RPB15MGR

 

 

38.1 (1.50)

RPB20MGR

 

 

50.8 (2.00)

RPB25MGR

 

 

63.5 (2.50)

MGR- series

RPB10MNR

25.4 (1.00)

41.9 (1.65)

25.4 (1.00)

TO-220

RPB15MNR

 

 

38.1 (1.50)

 

RPB20MNR

 

 

50.8 (2.00)

 

RPB25MNR

 

 

63.5 (2.50)

 

MPR- series

RPB10MPR

25.4 (1.00)

41.9 (1.65)

25.4 (1.00)

TO-220
TO-247
TO-218
15-LEAD MULTIWATT

RPB15MPR

 

 

38.1 (1.50)

RPB20MPR

 

 

50.8 (2.00)

RPB25MPR

 

 

63.5 (2.50)

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