Techsource Thermal Solutions' line of compact, power dissipating, aluminum extruded heatsinks for Power Semiconductors have pressed-in solderable pins to allow vertical mounting without stress on the device leads. Most are pre-drilled to accommodate a single TO- package.
CLICK ON PART NUMBER FOR SPECIFICATION SHEET ("HEIGHT" IS ABOVE PC BOARD)
D: mm(in.) W: mm(in.) H: mm(in.) PACKAGE 12.7 (.50) 34.9 (1.38) 25.4 (1.00) TO-218 38.1 (1.50) 50.8 (2.00) 63.5 (2.50) 12.7 (.50) 34.9 (1.38) 25.4 (1.00) TO-220 38.1 (1.50) 50.8 (2.00) 63.5 (2.50) 12.7 (.50) 34.9 (1.38) 25.4 (1.00) TO-220 38.1 (1.50) 50.8 (2.00) 63.5 (2.50) 16.26 (.64) 16.26 (.64) 25.4 (1.00) TO-220 38.1 (1.50) 50.8 (2.00) 25.4 (1.00) 41.9 (1.65) 25.4 (1.00) TO-220 38.1 (1.50) 50.8 (2.00) 63.5 (2.50) 25.4 (1.00) 41.9 (1.65) 25.4 (1.00) TO-218 38.1 (1.50) 50.8 (2.00) 63.5 (2.50) 25.4 (1.00) 41.9 (1.65) 25.4 (1.00) TO-220 38.1 (1.50) 50.8 (2.00) 63.5 (2.50) 25.4 (1.00) 41.9 (1.65) 25.4 (1.00) TO-220 38.1 (1.50) 50.8 (2.00) 63.5 (2.50) 25.4 (1.00) 41.9 (1.65) 25.4 (1.00) TO-220 38.1 (1.50) 50.8 (2.00) 63.5 (2.50)
TO-247
TO-218
TO-247
TO-218
15-LEAD MULTIWATT